IMS3TW 2010 - Call for Papers

Submission Deadline Extended to February 26th, 2010!

CALL FOR PAPERS

Scope -- Submissions -- Key Dates -- Additional Information -- Committees

Scope

The rapid pervasion of micro/nanoelectronics into various application fields like biology, chemistry, mechanics, optics, etc. is fostering unprecedented types of heterogeneous integrated systems and associated interfaces between these previously largely separate domains. Microsystems that combine advanced sensors and actuators with embedded, high-performance microprocessors are enabling an endless list of new applications in life sciences, aerospace, the environment, communications, etc. The design and test of such heterogeneous systems presents formidable challenges. In particular, as the inherent quality and reliability of the fundamental building blocks generally decreases with scale, the number of test and design-for-test, diagnosability, -manufacturability, -reliability considerations grows rapidly and their importance soars. The test of such systems is a multidimensional challenge that grows in criticality with increased levels of integration. Test requirements often only implied that individual or multiple signals of a specific nature needed to be observed or monitored. For heterogeneous systems, a mixture of different types of signals observed and/or monitored at different levels of integration or packaging, will need to be the focus of test procedures, for both low and high volume levels of production. In addition to the mixture of signals, a mixture of processes will need to be developed and implemented to encompass signal sensing, conversion and conditioning. Reliability assessment and external and/or self-diagnosis and -repair will become critical facets of such systems.

One and a half decades ago, the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design issues related to electronic systems with digital and analog components. In view of accelerated developments in heterogeneous system design and production, IMSTW was expended in 2008 to include new topics that address test, design for test, reliability and manufacturability of today’s sensors and sensor-based systems, as well as emerging devices and systems. Renamed to include sensors and systems, IMS3TW aims to bring together a community of researchers working on the next-generation of devices, circuits and systems. This year, IMS3TW will continue to address the traditional technology spectrum of IMSTW, in particular all aspects of analog, mixed-signal, and RF testing, but with increased attention to all aspects of current design complexity (e.g., parametric variability, power consumption, temperature effects). To guaranteeing design robustness for the new generation of nanoelectronic devices, we need to exploit self-monitoring functionality (such as self-test/-calibration), allowing the circuit or system to adapt to varying circuit parameters or functional demands. The sensors focus of the workshop will highlight all aspects of built-in sensors for device adaptation, MEMS, and biomedical applications such as lab-on-chip and implantable devices.

Primary Topics of Interest include:

Test & Design for (on/off-line) Test
Reliability & Design for Reliability
Fault and Error Modelling & Simulation

Verification & Design for Verification
Monitoring/Diagnosis & Design for Debug/Diagnosis
Fault Tolerance

Pertaining to the following systems or underlying technologies:

Analog/Mixed-Signal Circuits
Biomedical Circuits & Systems
RF & Wirelessly Controlled Devices
Optoelectronics & Photonics
Drug Delivery Microsystems

Lab-on-Chip
MEMs
Microfluidics
Heterogeneous Systems
Implantable Devices

Submissions

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Prospective authors are invited to submit papers on the topics of interest. Submissions should be via the workshop web-site and consist of either an extended summary of at least 750 words or a full paper. The accepted papers be published in an IEEE Computer Society Proceedings available on the IEEE digital library (EXPLORE).

A selection of papers will be invited to a special issue of JETTA, Journal of Electronic Testing.

Key Dates

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Submission deadline: February 26, 2010 (Extended Deadline)
Notification of acceptance: April 9, 2010
Final copy deadline: May 14, 2010

Additional Information

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General Information
Florence AZAIS
LIRMM, CNRS / U. Montpellier
161 rue Ada, 34392 Montpellier, France
Tel.: +33 467 418625
E-mail: florence.azais@lirmm.fr

Program Information
Krishnendu CHAKRABARTY
Duke University, Box 90291
130 Hudson Hall, Durham, NC 27708, USA
Tel.: +1 919 660-5244
E-mail: krish@ee.duke.edu

Committees

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General Chair
F. Azaïs, LIRMM, France

General Co-Chair
B. Kaminska, SFU, Canada

Program Committee Chair
K. Chakrabarty, Duke U., USA

Program Co-Chairs
Signals & Systems: A. Chatterjee, Georgia Tech, USA
Sensors: R. Genov, U. Toronto, Canada

Finance Chair
P. Nouet, LIRMM, France

Panel Chair
S. Ozev, Arizona State U., USA

New Initiatives Chair
B. Courtois, CMP, France

Support Infrastructure Co-Chairs
I. McWalker, CMC Microsystems, Canada
M.A. Maher, SoftMEMS, USA

Publicity Co-Chairs
S. Mir, TIMA, France
S. Sattler, Erlangen U., Germany

Publications Chair
H. Stratigopoulos, TIMA, France

TTTC Liaison
A. Ivanov, UBC, Canada

Local Arrangements
S. Bernard, LIRMM, France
M. Comte, LIRMM, France
F. Mailly, LIRMM, France

Program Committee (to include)
J. Abraham, U. Texas, USA
E. Acar, Intel, USA
K. Arabi, Qualcomm, USA
I. Bell, U. Hull, UK
A. Bermak, Hong Kong U., China
L. Carro, UFRGS, Brazil
S. Chakrabartty, Michigan State U., USA
E. Cretu, UBC, Canada
E. Culurciello, Yale Univ., USA
J. Figueras, UPC, Spain
G. Force, Texas Instruments, USA
V. Gruev, Washington U., USA
J.L. Huang, National U. Taiwan, Taiwan
J. Huertas-Diaz, IMSE-CNM/CSIC, Spain
N.M. Jokerst, Duke U., USA
D. Keezer, Georgia Tech., USA
H. Kerkhoff, MESA/U. Twente, Netherlands
M. Lubaszewski, UFRGS, Brazil
J. Machado da Silva, U Porto, Portugal
A. Mason, Michigan State, USA
P. Mohseni, Case Western Reserve U., USA
A. Osseiran, Edith Cowan U., Australia
M. Renovell, LIRMM, France
A. Richardson, U. Lancaster, UK
A. Rueda, U. Sevilla, Spain
Y. Savaria, Ecole Poly., Canada
M. Sawan, Ecole Poly., Canada
M. Slamani, IBM, USA
M. Soma, U. Washington, USA
P. Teixeira, INESC, Portugal
C. Wegener, National Semicond., Germany
F.M. Werner, SUSS MicroTec, Germany

Steering Committee
B. Kaminska (Chair)
J. Abraham
A. Chatterjee
B. Courtois
J. Huertas-Diaz
H. Kerkhoff
A. Ivanov
A. Osseiran
M. Renovell
A. Richardson
M. Soma

For more information, visit us on the web at: http://www.event URL.com

The 16th International Mixed-Signals, Sensors, and Systems Test Workshop (IMS3TW 10) is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).